Modular design
General rackmount chassis; a variety of modular rear windows for rapid response to customer needs; fans, power supplies, and hard drives are all modular designed to improve system reliability and heat dissipation, and facilitate future maintenance.
Strong scalability
Supports 10 PCle4.0/3.0 high-speed expansion slots to provide rich expansion capabilities. Multiple 12Gb SAS/SATA/NVMe adaptive backplanes are available, offering flexibility and convenience. Customized expansion requirements are available for customers via adapter cards.
High performance
Support single/dual-socket AMD Milan EPYC 7003 processors, based on Zen 3 cores, each core has up to 32MB of L3 cache, 19% single-core performance improvement, 12Gb SAS backplane supports 1~4 double-width high power consumption GPU; support 16 dual-channel DDR4/2666/2933 memory slots. Motherboard supports NVMe(M.2) cache interface to meet high computing requirements for cloud computing, big data, and virtual computing.
Intelligent power supply and temperature control
Adopt 1+1 redundant power supply, support hot-swap replacement, and ensure the stability of the system; adopt intelligent temperature-controlled fan module, support hot-swap replacement, and has excellent shock resistance design.
